Ohmi (New Industry Creation Hatchery Center, Tohoku U., Japan) presents 10 chapters that introduce radical-reaction-based and wet process technologies for manufacturing large-scale integrated (LSI) semiconductors and flat panel displays (FPD). Ohmi first introduces the topic of surface chemical electronics at the semiconductor survey. The following chapters address the principles of semiconductor device wet cleaning, high-performance wet cleaning technology, etching of SiO2, silicon etching, chemical composition control technology, wet vapor resist stripping technology, antistatic technology, chemical waste reclamation technology, and advanced ultrapure water and liquid chemical supply systems and materials for a fluctuation-free facility.